STENCIL CLEANING
AQUANOX A8820 is an engineered Micro Cell Technology (MCT'”) cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. A8820 is commonly used to clean the stencil once removed from the stencil printer. NOTE: Also ovoiloble in Ready to Use AQUANOX A8820D
AQUANOX A8830 is a mild formulation that does not damage stencils and is highly effective at removing all types of solder pastes (water soluble, rosin, and no-clean) from fine pitch apertures. A8830 is a low odor cleaner that can be used in open systems. The green environmental properties of AQUANOX A8830 make it an ideal option for areas where air emissions are highly regulated.
AQUANOX A8831 is a mild formulation that is compatible with stencils and effectively removes all types of solder pastes (water soluble, rosin, and no-clean) from fine pitch apertures. A8831 is a low odor cleaner than can be used in open systems. The green environmental properties of AQUANOX A8831 make it an ideal option for areas where air emissions ore highly regulated.
CYBERSOLV C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes.
CYBERSOLV C8622 is a full-strength solvent blend specifically designed as on IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, CYBERSOLV (8622 is applied in applications where IPA is typically used.
KYZEN E5611 (N) is a cost effective cleaning chemistry designed to be diluted for removing flux, solder paste and uncured
adhesives from stencils and misprints. E5611 (N) has proven compatible with most standard stencil cleaning equipment.
KYZEN E5631 is a cost effective solution formulated to clean flux and uncured adhesives from stencils and misprints. E5631 is designed to be diluted and used in stencil cleaning processes including spray-in-air and ultrasonic processes. KYZEN E5631 has been proven compatible with stencils and materials of construction found in stencil cleaning equipment.
| STENCIL CLEANING | SOILS REMOVED | PROCESS | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| OA / WATER SOLUBLE | NO CLEAN / RMA | MISPRINT UNCURED ADHESIVE | MISPRINT RAW SOLDER PASTE | UNDERSTENCIL WIPE | HAND-HELD ULTRASONIC TRANSDUCER | ULTRASONIC WASH WATER RINSE | ULTRASONIC WASH CLEANER RINSE | SPRAY-IN-AIR WASH WATER RINSE | SPRAY-IN-AIR WASH CLEANER RINSE | |
| AQUANOX® A8820 | X | X | X | X | X | X | X | X | ||
| AQUANOX® A8830 | X | X | X | |||||||
| AQUANOX® A8831 | X | X | X | X | ||||||
| CYBERSOLV® A8882 | X | X | X | X | X | X | ||||
| CYBERSOLV® A8622 | X | X | X | |||||||
| KYZEN® E5611 (N) | X | X | X | X | X | X | X | X | ||
| KYZEN® E5631 | X | X | X | X | X | X | X | X | X | |
AQUEOUS PCB CLEANING
AQUANOX A4241 (N) is an innovative aqueous cleaning solution designed to be effective on the toughest soils while protecting even the most sensitive ports from etch or darkening. A4241(N) is multi-metal safe, including bare aluminum and copper, environmentally friendly, has an adjusted stabilizer package, a long tank life and is safe for multi-pass applications.
AQUANOX A4625B (N) is a versatile aqueous cleaning chemistry designed to clean the latest lead-free residues while providing brilliant mirrored solder finishes. AQUANOX A4625B (N) is specifically designed to remove all types of electronic flux residues, including the latest lead-frees, in batch washers.
AQUANOX A4727 is engineered to be effective, stable and predictable, all day, every day. A4727 is designed for reliable production and assembly operations. Meet your performance cleaning requirements with advanced technology that gives a stable pH and predictable compatibility throughout its long bath life. Environmentally responsible, AQUANOX A4727 can be used at low concentrations to effectively remove even the toughest soils and rinse easily and completely. This easy to control and cost effective solution is a good choice for both in-line and batch cleaning systems.
AQUANOX A4639 (N) is an engineered aqueous cleaning fluid that is effective on a wide range of soils at low operating temperatures and concentrations. AQUANOX A4639 (N) provides exceptional cleaning results and protection of metallic surfaces with minimal monitoring and no sump-side additives.
AQUANOX A4651 US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX A4651 US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the latest flux formulations in electronic assemblies.
| AQUEOUS PCB CLEANING | SOILS REMOVED | PROCESS | ||||
|---|---|---|---|---|---|---|
| OA / WATER SOLUBLE | NO CLEAN | RMA / RA | IMMERSION ULTRASONIC | SPRAY (IN-LINE) | SPRAY (BATCH) | |
| AQUANOX® A4241 (N) | X | X | X | X | ||
| AQUANOX® A4625B (N) | X | X | X | X | X | |
| AQUANOX® A4727 | X | X | X | X | X | |
| AQUANOX® A4639 (N) | X | X | X | X | ||
| AQUANOX® A4651US | X | X | X | X | ||
SEMI- AQUEOUS & SOLVENT CLEANING
IONOX FCR is a high-strength, concentrated cleaner designed to be used in immersion agitation, ultrasonic or centrifugal systems. IONOX FCR effectively removes virtually all types of fluxes including rosin, water soluble, lead-free and low residue products. A water rinse is required to remove all traces of soils and cleaner residues from substrate surfaces.
MICRONOX MX2501 is an engineered precision vapor cleaning solvent designed as a drop in replacement for modern
era vapor degreasing equipment. MX2501 has “Zero” ozone-depletion potential and con replace TCE & TCA in
many cleaning applications.
| SEMI- AQUEOUS & SOLVENT CLEANING | SOILS REMOVED | PROCESS | ||||
|---|---|---|---|---|---|---|
| OA / WATER SOLUBLE | NO CLEAN | RMA / RA | IMMERSION ULTRASONIC | SPRAY UNDER-IMMERSION | VAPOR DEGREASING | |
| IONOX® FCR | X | X | X | X | X | |
| MICRONOX® MX2501 | X | X | X | |||
BENCHTOP AND MAINTENANCE CLEANING
CYBERSOLV C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. It has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lead-free flux.
CYBERSOLV C8502 is specially formulated to quickly remove all types of flux residues from wove solder fingers, reflow oven surfaces and general electronics production equipment. C8502 is also effective on rosin flux used on fabrication of dissimilar
metals on industrial components .
KYZEN E5321 N (LF) is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead-free high temperature flux residues from wove pallets and filters. Some maintenance applications may require higher concentrations and KYZEN Booster 20 is available for ports with aluminum hardware.
CYBERSOLV 141-R is a precision cleaner blend of organic solvents that is safe and ready to use for bench-top electronics cleaning. CYBERSOLV 141-R is effective on a wide variety of soils typically found in electronic assembly and maintenance cleaning applications. Note: Available in Aerosol and Bulk Packaging
| BENCHTOP AND MAINTENANCE CLEANING | SOILS REMOVED | PROCESS | |||||||
|---|---|---|---|---|---|---|---|---|---|
| OA / WATER SOLUBLE | NO CLEAN / RMA | MISPRINT UNCURED ADHESIVE | RAW SOLDER PASTE | ULTRASONIC | IMMERSION / SOAK | SPRAY | MANUAL | ||
| Oven | CYBERSOLV® C8508 | X | X | X | X | X | X | ||
| Wave Solder Finger Cleaner | CYBERSOLV® C8502 | X | X | X | X | X | X | ||
| Maintenance Pallets | KYZEN® E5321N (LF) | X | X | X | X | X | X | X | |
| Rework | CYBERSOLV® 141R | X | X | X | |||||