LD-5 Inline Laser Depaneling Machine

Features

• Granite platform, high precision, stability durability;
• Linear motor drive, high speed, low noise, no vibration;
• Linear scale positioning, repetition accuracy up to ±2 μm;
• Three section on-line track, high cutting efficiency;
• Large working size range, 400*400mm;
• Green and UV sources are optional;
• Laser line width less than 20μm;
• External purification unit.

Application Products And Industry

SMT Industry — FPCB, PCBA, soft and hard combined PCB board and drilling

Semiconductor Industry — Wafer microhole, blind hole processing, and Wafer shaped cutting